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6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
PACKAGE
H11N2-M
H11N3-M
SCHEMATIC
ANODE 1
6 VCC
6 6 1 1
3 4 VO CATHODE 2 5 GND
6
1
DESCRIPTION
The H11NX-M series has a high speed integrated circuit detector optically coupled to an AlGaAs infrared emitting diode. The output incorporates a Schmitt trigger, which provides hysteresis for noise immunity and pulse s haping. The detector circuit is optimized for simplicity of operation and utilizes an open collector output for maximum application flexibility.
Truth Table
Input H L Output L H
FEATURES
* * * * * * * * * * High data rate, 5 MHz typical (NRZ) Free from latch up and oscilliation throughout voltage and temperature ranges. Microprocessor compatible drive Logic compatible output sinks 16 mA at 0.5 V maximum Guaranteed on/off threshold hysteresis Wide supply voltage capability, compatible with all popular logic systems High common mode transient immunity, 2000 V/s minimum Fast switching t r = 7.5ns typical, t f = 12ns typical Underwriter Laboratory (UL) recognized--file #E90700 VDE recognized - File#102497 - Add option V (e.g., H11N1VM)
APPLICATIONS
* * * * * * Logic to logic isolator Programmable current level sensor Line receiver--eliminate noise and transient problems A.C. to TTL conversion--square wave shaping Interfaces computers with peripherals Isolated power MOS driver for power supplies
(c) 2003 Fairchild Semiconductor Corporation
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6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M H11N2-M H11N3-M
ABSOLUTE MAXIMUM RATINGS
Parameters TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation @ 25C Derate Above 25C EMITTER Continuous Forward Current Reverse Voltage Forward Current - Peak (1 s pulse, 300 pps) LED Power Dissipation 25C Ambient Derate Linearly From 25C DETECTOR Detector Power Dissipation @ 25C Derate Linearly from 25C V45 Allowed Range V65 Allowed Range I4 Output Current PD VO VCC IO All All All All 150 1.76 0 to 16 0 to 16 50 mW mW/C V V mA IF VR IF(pk) PD All All All All 30 6 1.0 120 1.41 mA V A mW mW/C TSTG TOPR TSOL PD All All All All -55 to +150 -40 to +85 260 for 10 sec 250 2.94 C C C mW mW/C Symbol Device Value Units
ELECTRICAL CHARACTERISTICS (TA = 0-70C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS
Parameters EMITTER Input Forward Voltage Reverse Current Capacitance DETECTOR Operating Voltage Range Supply Current Output Current, High *Typical values at TA = 25C
(c) 2003 Fairchild Semiconductor Corporation
Test Conditions
Symbol
Device
Min
Typ*
Max
Units
IF = 10 mA IF = 0.3 mA VR = 5 V V = 0, f = 1.0 MHz
VF IR CJ VCC
All All All
1.4 0.75 1.25
2 V 10 100 A pF
All All All
4 6
15 10 100
V mA A
IF = 0, VCC = 5V IF = 0.3mA, VCC = VO = 15V
ICC(off) IOH
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6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M H11N2-M H11N3-M
TRANSFER CHARACTERISTICS
DC Characteristics Supply Current Output Voltage, low Test Conditions IF = 10mA, VCC = 5V RL=270,VCC=5V, IF=IF(on) max. RL=270, VCC = 5V note 1 RL=270, VCC = 5V RL=270, VCC = 5V Test Conditions Symbol ICC(on) VOL IF(on) IF(off) IF(off)/IF(on) Symbol Device All All H11N1-M H11N2-M H11N3-M Turn-Off Threshold Current Hysteresis Ratio AC Characteristics SWITCHING SPEED Propagation delay time High to Low Rise Time Propagation delay time Low to High Fall time Data Rate C=120pF, tP=1s, RE: Note 2 Fig. 1 C=120pF, tP=1s, RE: Note 2 Fig. 1 C=120pF, tP=1s, RE: Note 2 Fig. 1 C=120pF, tP=1s, RE: Note 2 Fig. 1 tPHL tr tPLH tf All All All All All 100 7.5 150 12 5 330 330 ns ns ns ns MHz All All Device 0.8 2.3 4.1 0.3 0.65 Min Typ 0.95 Max Units Min Typ* 6.5 Max 10 0.5 3.2 5 10 mA mA Units mA V
Turn-On Threshold Current
ISOLATION CHARACTERISTICS
Parameters Input-Output Isolation Voltage Isolation Capacitance Isolation Resistance *Typical values at TA = 25C NOTES: 1. Maximum IF(ON) is the maximum current required to trigger the output. For example, a 3.2mA maximum trigger current would require the LED to be driven at a current greater than 3.2mA to guarantee the device will turn on. A 10% guard band is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 30mA. 2. H11N1: RE = 910 H11N2: RE = 560 H11N3: RE = 240 Test Conditions f = 60 Hz, t =1 sec. VI-O = 0V, f = 1 MHz VI-O = 500 VDC Symbol VISO CISO RISO 1011 Min 7500 0.4 0.6 Typ* Max Units VPEAK pF
(c) 2003 Fairchild Semiconductor Corporation
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6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
C IF RE VIN 1 H11N1-M 6 4 0.1F RL
H11N2-M
H11N3-M
I6
5V
VIN 5V
50%
0 270
VO
ton toff
tr = tf 0.01S Z = 50
2
5
10%
VO
90%
tf
tr
Figure 1. Switching Test Circuit and Waveforms
Figure 2. Transfer Characteristics
6 1.4
Figure 3. Threshold Current vs. Supply Voltage
IF - NORMALIZED THRESHOLD CURRENT
5
VOH
VCC = 5V RL = 270 TA = 25C
1.2 1.0 0.8
TURN ON THRESHOLD D
VO - OUTPUT VOLTAGE (V)
4
TURN OFF THRESHOLD
3 IF(OFF) 2 Hysteresis area shaded for illustration 1 VOL 0 0 1 2 3 4 IF(ON)
0.6 0.4 0.2 0.0 0 2 4 6 8 10 12 14 16 VCC - SUPPLY VOLTAGE (V)
: NORMALIZED TO: TURN ON THRESHOLD AT VCC = 5V, TA = 25C
IF - INPUT CURRENT (mA)
Figure 4. Threshold Current vs. Temperature
1.2 100
Figure 5. Load Current vs. Output Voltage
NORMALIZED THRESHOLD CURRENT IF(On), IF(Off)
1.0
IF(On) IF(Off)
0.8
IO - LOAD CURRENT (mA)
0.6
10
IF = IF(ON) VCC = 5V
0.4
NORMALIZED TO : VCC = 5V TA = 25C
0.2
0.0 0 10 20 30 40 50 60 70
1 0.0
0.2
0.4
0.6
0.8
1.0
TA - TEMPERATURE (C)
VO - OUTPUT VOLTAGE, LOW (V)
(c) 2003 Fairchild Semiconductor Corporation
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6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M H11N2-M H11N3-M
Figure 7. LED Forward Voltage vs. Forward Current
100
Figure 6. Supply Current vs. Supply Voltage
12
10
TA = -25C
8 TA = 25C 6
IF - FORWARD CURRENT (mA)
IC - SUPPLY CURRENT (mA)
TA = 85C 10
TA = -25C TA = 25C
4
TA = 85C
2
ON STATE I F = 10mA OFF STATE I F = 0
0 2 4 6 8 10 12 14 16
1 1.0 1.2 1.4 1.6 1.8 2.0
VCC - SUPPLY VOLTAGE (V)
VF - FORWARD VOLTAGE (V)
(c) 2003 Fairchild Semiconductor Corporation
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6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
Package Dimensions (Through Hole)
0.350 (8.89) 0.320 (8.13)
H11N2-M
H11N3-M
Package Dimensions (Surface Mount)
0.350 (8.89) 0.320 (8.13)
0.260 (6.60) 0.240 (6.10)
0.260 (6.60) 0.240 (6.10)
0.390 (9.90) 0.332 (8.43)
0.070 (1.77) 0.040 (1.02)
0.070 (1.77) 0.040 (1.02)
0.014 (0.36) 0.010 (0.25) 0.320 (8.13)
0.320 (8.13) 0.014 (0.36) 0.010 (0.25)
0.200 (5.08) 0.115 (2.93)
0.200 (5.08) 0.115 (2.93)
0.012 (0.30) 0.008 (0.20)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15 0.012 (0.30)
0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41)
0.100 [2.54] 0.035 (0.88) 0.006 (0.16)
Package Dimensions (0.4" Lead Spacing)
0.350 (8.89) 0.320 (8.13)
Recommended Pad Layout for Surface Mount Leadform
0.260 (6.60) 0.240 (6.10)
0.070 (1.78)
0.060 (1.52)
0.070 (1.77) 0.040 (1.02)
0.014 (0.36) 0.010 (0.25)
0.425 (10.79)
0.100 (2.54) 0.305 (7.75) 0.030 (0.76)
0.200 (5.08) 0.115 (2.93)
0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16)
(c) 2003 Fairchild Semiconductor Corporation
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6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
ORDERING INFORMATION
Option/Order Entry Identifier S SR2 T V TV SV SR2V Description Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel
H11N2-M
H11N3-M
MARKING INFORMATION
1
H11N1 V
3 4
2 6
X YY Q
5
Definitions
1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code, e.g., `3' Two digit work week ranging from `01' to `53' Assembly package code
*Note - Parts that do not have the `V' option (see definition 3 above) that are marked with date code `325' or earlier are marked in portrait format.
(c) 2003 Fairchild Semiconductor Corporation
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6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M
Carrier Tape Specifications
12.0 0.1 4.5 0.20 2.0 0.05 0.30 0.05 4.0 0.1 O1.5 MIN 1.75 0.10
H11N2-M
H11N3-M
11.5 1.0 21.0 0.1 9.1 0.20 24.0 0.3
0.1 MAX
10.1 0.20
O1.5 0.1/-0
User Direction of Feed
NOTE All dimensions are in inches (millimeters) Reflow Profile (White Package, -M Suffix)
300 Temperature (C) 250 200 150 100 50 0 0 0.5 1 1.5 2 2.5 245C peak
230C, 10-30 s
Time above 183C, 120-180 sec Ramp up = 2-10C/sec * Peak reflow temperature: 245C (package surface temperature) * Time of temperature higher than 183C for 120-180 seconds * One time soldering reflow is recommended 3.5 4 4.5
3
Time (Minute)
(c) 2003 Fairchild Semiconductor Corporation
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6-PIN DIP HIGH SPEED LOGIC OPTOCOUPLERS
H11N1-M H11N2-M H11N3-M
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
(c) 2003 Fairchild Semiconductor Corporation
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